128 layer HYMOSS module fabrication issues

Details 128 layer HYMOSS module fabrication issues 128 layer HYMOSS module fabrication issues

Nov 1990

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=1990spie.1339..204l&link_type=abstract

IN: Materials, devices, techniques, and applications for Z-plane focal plane array technology II; Proceedings of the Meeting, Sa

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Applications

Computer Aided Manufacturing, Electronic Modules, Focal Plane Devices, Infrared Detectors, Integrated Circuits, Photolithography, Mercury Cadmium Tellurides, Mosaics, Production Engineering

Scientific paper

The fabrication of the first Z-technology module with 128 active layers of readout electronic circuitry is being pursued. Several issues which will be investigated regarding the 128-layer module build, such as photolithographic processing at the edge of the module (edge effects) and module buttability, are discussed in this paper. Other topics which are covered apply to future applications of fully populated HYMOSS modules. These topics include possible reductions of thermal mass for quick cool-down time applications and improvements of end-to-end yield for low-cost applications.

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