Automation of IRFPA production processes

Details Automation of IRFPA production processes Automation of IRFPA production processes

Nov 1990

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=1990spie.1339..212e&link_type=abstract

IN: Materials, devices, techniques, and applications for Z-plane focal plane array technology II; Proceedings of the Meeting, Sa

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Applications

Automation, Computer Aided Manufacturing, Focal Plane Devices, Infrared Instruments, Liquid Phase Epitaxy, Cadmium Tellurides, Infrared Detectors, Mercury Cadmium Tellurides, Production Costs

Scientific paper

This paper examines three applications of automation technology in the manufacture of Infrared Focal Plane arrays. Areas to be examined are wafer handling during array fabrication up through dicing, automation of Liquid Phase Epitaxy, and automation of bump bonding. The collection of factory data and its use in control of the manufacturing process will also be discussed. Specifics related to the production of Z-module architecture will be emphasized.

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