Physics – Instrumentation and Detectors
Scientific paper
2003-12-11
IEEE Trans. Nucl. Sci., vol. 51, no. 4, pp. 1717-1723, Aug. 2004
Physics
Instrumentation and Detectors
6 pages, 14 figures, IEEE NSS 2003 conference paper, submitted to IEEE TNS
Scientific paper
Multichip modules (MCM) with 4 single photon counting MPEC 2.3 chips bump bonded to 1.3 cm x 1.3 cm large CdTe and Si semiconductor sensors as well as to single chip pixel detectors have been successfully built and operated. The MPEC 2.3 chip provides a pixel count rate up to 1 MHz with a large dynamic range of 18 bit, 2 counters and energy windowing with continuously adjustable thresholds. Each MPEC has 32 x 32 pixels of 200 um x 200 um pixel size. For a MCM the 4 chips are arranged in a 2 x 2 array which leads to a 64 x 64 sensor pixel geometry. The MCM construction is described, and the imaging performance of the different detectors is shown. As readout system a newly developed USB system has been used.
Fischer Peter
Krimmel Sven
Krueger Hans
Lindner Markus
Loecker Mario
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