New package for CMOS sensors

Details New package for CMOS sensors New package for CMOS sensors

Feb 2004

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2004spie.5251..225d&link_type=abstract

Detectors and Associated Signal Processing. Edited by Chatard, Jean-Pierre; Dennis, Peter N. J. Proceedings of the SPIE, Volume

Physics

Scientific paper

Cost is the main drawback of existing packages for C-MOS sensors (mainly CLCC family). Alternative packages are thus developed world-wide. And in particular, S.T.Microelectronics has studied a low cost alternative packages based on QFN structure, still with a cavity. Intensive work was done to optimize the over-molding operation forming the cavity onto a metallic lead-frame (metallic lead-frame is a low cost substrate allowing very good mechanical definition of the final package). Material selection (thermo-set resin and glue for glass sealing) was done through standard reliability tests for cavity packages (Moisture Sensitivity Level 3 followed by temperature cycling, humidity storage and high temperature storage). As this package concept is new (without leads protruding the molded cavity), the effect of variation of package dimensions, as well as board lay-out design, are simulated on package life time (during temperature cycling, thermal mismatch between board and package leads to thermal fatigue of solder joints). These simulations are correlated with an experimental temperature cycling test with daisy-chain packages.

Affiliated with

Also associated with

No associations

Rating

New package for CMOS sensors does not yet have a rating. At this time, there are no reviews or comments for this scientific paper.

If you have personal experience with New package for CMOS sensors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and New package for CMOS sensors will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFWR-SCP-O-1489567