Physics – Optics
Scientific paper
Jan 2002
adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2002iaf..confe.573s&link_type=abstract
IAF abstracts, 34th COSPAR Scientific Assembly, The Second World Space Congress, held 10-19 October, 2002 in Houston, TX, USA.,
Physics
Optics
Scientific paper
The Experiment Support Facility - External (ESF-X) is a computer designed for general experiment use aboard the International Space Station (ISS) Truss Site locations. The ESF-X design is highly modular and uses commercial off-the-shelf (COTS) components wherever possible to allow for maximum reconfigurability to meet the needs of almost any payload. The ESF-X design has been developed with the EXPRESS Pallet as the target location and the University of Colorado's Micron Accuracy Deployment Experiment (MADE) as the anticipated first payload and capability driver. Thus the design presented here is configured for structural dynamics and control as well as optics experiments. The ESF-X is a small (58.4 x 48.3 x 17.8") steel and copper enclosure which houses a 14 slot VME card chassis and power supply. All power and data connections are made through a single panel on the enclosure so that only one side of the enclosure must be accessed for nominal operation and servicing activities. This feature also allows convenient access during integration and checkout activities. Because it utilizes a standard VME backplane, ESF-X can make use of the many commercial boards already in production for this standard. Since the VME standard is also heavily used in industrial and military applications, many ruggedized components are readily available. The baseline design includes commercial processors, Ethernet, MIL-STD-1553, and mass storage devices. The main processor board contains four TI 6701 DSPs with a PowerPC based controller. Other standard functions, such as analog-to-digital, digital-to-analog, motor driver, temperature readings, etc., are handled on industry-standard IP modules. Carrier cards, which hold 4 IP modules each, are placed in slots in the VME backplane. A unique, custom IP carrier board with radiation event detectors allows non RAD-hard components to be used in an extended exposure environment. Thermal control is maintained by conductive cooling through the copper floor of the enclosure. All components, including the VME backplane, are thermally connected to the floor. The VME chassis can accept both conduction-cooled and convection cooled cards; non-conduction-cooled cards are simply thermal-strapped to the VME chassis. The current ESF-X configuration provides 44 high-rate A/D, 48 low-rate temperature RTDs, 32 digital IO channels (DIO), as well as drivers for digital position encoders, video frame grabbers, an optical interferometry system, stepper motors, paraffin actuators, high torque DC brushless motors, and piezoelectric actuators based on capability demands derived from the MADE program. ESF-X is presently in the critical design phase; potential users are welcome to submit comments and capability requests.
Chen S. E.
Sell S. W.
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