Astronomy and Astrophysics – Astronomy
Scientific paper
Jul 2006
adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2006spie.6276e...2l&link_type=abstract
High Energy, Optical, and Infrared Detectors for Astronomy II. Edited by Dorn, David A.; Holland, Andrew D.. Proceedings of th
Astronomy and Astrophysics
Astronomy
Scientific paper
Large area focal planes for the next generation of astronomical instruments require very flat imaging surfaces (< 10 μm peak-valley) over significant sizes (20 - 100 cm), accurate alignment of detector height, stable operation at low temperature, and fully-buttable packaging with large I/O requirements to connect multiple amplifiers per detector. These requirements are often mutually exclusive and therefore difficult to obtain in a single focal plane. In this paper we discuss the hybridization or flip chip bonding technique and associated focal plane mounting methods to achieve these goals. Specifically, we describe a technique to hybridize CCD detectors onto high thermal conductivity ceramic with vias that lead to the I/O signals underneath the detectors. Packaging methods to mount such devices with a total flatness non-uniformity of less than 10 microns are presented. The requirements of achieving sub-5 microns flatness are also discussed.
Lesser Michael
Ouellette David
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