Honeycomb-panel spacecraft radiator with multichip module thermal analysis and vacuum-testing

Details Honeycomb-panel spacecraft radiator with multichip module thermal analysis and vacuum-testing Honeycomb-panel spacecraft radiator with multichip module thermal analysis and vacuum-testing

Jan 1997

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=1997aipc..387..801c&link_type=abstract

Space technology and applications international forum (STAIF - 97). AIP Conference Proceedings, Volume 387, pp. 801-812 (1997).

Statistics

Applications

Spaceborne And Space Research Instruments, Apparatus, And Components, Heat Conduction, Heat Flow In Porous Media, Thermal Radiation

Scientific paper

This paper documents a thermal vacuum test and analysis of three small honeycomb panels for spacecraft application. The prime purpose of this test was to characterize the thermal performance of 24.1 cm×31.8 cm (9.5 in×12.5 in) honeycomb panels that use composite face-sheets with a power dissipating Multichip Module (MCM) mounted on one side. The test MCM simulates electronic circuits and computer components, and the goal is to simplify spacecraft design by the reduction of cabling. The MCM heat was generated with fused film heaters, and temperatures and powers were measured to assess several thermal performance enhancement options. The MCM heat was dissipated through the honeycomb panel to the thermal vacuum chamber. The paper presents test data and a brief description of our thermal modeling results. The maximum power dissipated by a MCM heater 1.27 cm×1.27 cm (0.5 in×0.5 in), that was maintained at 393K (120C), was 12.8-watts. A high conductivity thermal doubler mounted between the MCM and the base was found to be a significant heat rejection enhancement.

Affiliated with

Also associated with

No associations

Rating

Honeycomb-panel spacecraft radiator with multichip module thermal analysis and vacuum-testing does not yet have a rating. At this time, there are no reviews or comments for this scientific paper.

If you have personal experience with Honeycomb-panel spacecraft radiator with multichip module thermal analysis and vacuum-testing, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Honeycomb-panel spacecraft radiator with multichip module thermal analysis and vacuum-testing will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFWR-SCP-O-1784267