Silicon TSV interposers for photonics and VLSI packaging

Details Silicon TSV interposers for photonics and VLSI packaging Silicon TSV interposers for photonics and VLSI packaging

Feb 2011

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2011spie.7928e...5v&link_type=abstract

Reliability, Packaging, Testing, and Characterization of MEMS/MOEMS and Nanodevices X. Edited by Garcia-Blanco, Sonia; Ramesham,

Computer Science

Performance

Scientific paper

Miniaturization, higher performance, and higher bandwidth needs of the electronic industry continue to drive technology innovations through increased levels of integration. Through Silicon Via (TSV) technology along with flip chip technology provides significant improvements over the traditional technologies for packaging VLSI circuits. Silicon Interposers built using TSVs and embedded capacitors provide solutions to the next generation needs of VLSI Packaging. TSV Si interposers also provide a paltform for integrating photonic elements like the laser diodes and optical fibers for next generation high bandwidth VLSI packaging. The presentation describes (i) the TSV technologies developed, (ii) implementation of Si TSV interposer with embedded capacitors for VLSI packaging, and (iii) development of Si TSV interposer for integration of photonics and VLSI subsystems. Reliability results of interposers with embedded capacitors are also presented.

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