The milling process monitoring using 3D envelope method

Details The milling process monitoring using 3D envelope method The milling process monitoring using 3D envelope method

2012-01-21

arxiv.org/abs/1201.4442v1

Journal of Advanced Materials Research 423 (2012) 77-88

Computer Science

Other Computer Science

Scientific paper

This paper proposes a method to vibration analysis in order to on-line monitoring of milling process quality. Adapting envelope analysis to characterize the milling tool materials is an important contribution to the qualitative and quantitative characterization of milling capacity and a step by modeling the three-dimensional cutting process. An experimental protocol was designed and developed for the acquisition, processing and analyzing three-dimensional signal. The vibration envelope analysis is proposed to detect the cutting capacity of the tool with the optimization application of cutting parameters. The research is focused on Hilbert transform optimization to evaluate the dynamic behavior of the machine/ tool/workpiece.

Affiliated with

Also associated with

No associations

Rating

The milling process monitoring using 3D envelope method does not yet have a rating. At this time, there are no reviews or comments for this scientific paper.

If you have personal experience with The milling process monitoring using 3D envelope method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and The milling process monitoring using 3D envelope method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFWR-SCP-O-134777