Computer Science – Performance
Scientific paper
Jun 1996
adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=1996spie.2745...50h&link_type=abstract
Proc. SPIE Vol. 2745, p. 50-54, Infrared Readout Electronics III, Eric R. Fossum; Ed.
Computer Science
Performance
Scientific paper
Pressures to increase resolution, achieve compact packages, and lower costs continue to drive focal plane readout circuits to highly complex designs with lowered yields in cutting edge processes. By designing a set of signal processing electronics into a 3D structure, cost and performance goals can be met while using higher yielding readouts and existing focal plane hybrids. The approach described in this paper allows existing designs from 480 X 4 through 480 X 640 to be used in compact sensor designs in a wide variety of applications. The demonstration of the approach uses an existing InSb photovoltaic hybrid array in a 120 X 160 configuration. Functions for non- uniformity correction, memory, and analog-to-digital conversion have been incorporated into a structure compatible with conventional dewar assemblies for military and commercial applications. The technology for these 3D focal planes is applicable to sensor functions for non- uniformity correction, analog-to-digital conversion, spatial and temporal filtering, fovea vision, event-driven multiplexing, data compression and coding, and pattern recognition.
No associations
LandOfFree
Three-dimensional sensor readout electronics using conventional detector hybrid assemblies does not yet have a rating. At this time, there are no reviews or comments for this scientific paper.
If you have personal experience with Three-dimensional sensor readout electronics using conventional detector hybrid assemblies, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Three-dimensional sensor readout electronics using conventional detector hybrid assemblies will most certainly appreciate the feedback.
Profile ID: LFWR-SCP-O-1304499