Materials Opportunity to Electronic Composite Enclosures for Aerospace and Spacecraft Thermal Management

Details Materials Opportunity to Electronic Composite Enclosures for Aerospace and Spacecraft Thermal Management Materials Opportunity to Electronic Composite Enclosures for Aerospace and Spacecraft Thermal Management

Jan 2006

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2006aipc..813...19w&link_type=abstract

SPACE TECH.& APPLIC.INT.FORUM-STAIF 2006: 10th Conf Thermophys Applic Microgravity; 23rd Symp Space Nucl Pwr & Propulsion; 4th C

Computer Science

Performance

1

Spaceborne And Space Research Instruments, Apparatus, And Components, Circuits And Circuit Components

Scientific paper

Transition in spacecraft development from aluminum to light weight/high performance avionic composite enclosures will be reviewed that influences the new initiative in aerospace thrust, including missile application. Discussion will focus on the type of processed hybrid cooled and passive composite enclosures and internal lightweight, high conductivity composite and graphitic thermal plane heat sinks. Applications are for electronic circuit boards for spacecraft up to 40W/card (VME, PCI architectures) to 120W/card for aircraft application.

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