Physics of x ray multilayer structures: Summaries of papers presented at the physics of x ray multilayer structures topical meeting, technical digest series, 1992, volume 7

Astronomy and Astrophysics – Astronomy

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Integrated Circuits, Laminates, Metrology, Microscopy, Mirrors, Plasma Diagnostics, Spectroscopy, X Ray Analysis, X Ray Astronomy, X Ray Diffraction, X Ray Lasers, Deposition, Extreme Ultraviolet Radiation, Fabrication, Surface Roughness

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The present state-of-the-art of multilayer optics is reviewed. Different theories to model the performance of multilayer structures are compared and the influence of imperfections are discussed. Optimized coating designs for the XUV are compared to perfect crystals, as used in x-ray diffraction and laser mirrors, as used for visible light. Practically all deposition methods were used for the fabrication of x-ray multilayer structures, and we summarize their strengths and weaknesses. Material combinations for a specific application are first selected by the optical constants at a specific wavelength and the by the requirement that the materials chosen must form atomically abrupt, smooth, and stable boundaries. Only a handful of combinations are in practical use. The limit on the performance of multilayer structures is given by absorption and by the roughness of the boundaries. The shortest practically useful multilayer period is limited by boundary roughness and a drastic improvement at shorter periods can only be expected if we learn to place atoms by a nonrandom process. Multilayer structures have permitted the extension of classical optics into the soft x ray range. The shorter wavelength should make it possible to build instruments with a resolution that is 100 times better than that of similar instruments for visible light. However, this goal can only be reached with 100 times tighter fabrication tolerances. It appears that recent progress in metrology will make such a performance available during the next decade. Multilayer structures have been used in x-ray astronomy, microscopy, spectroscopy, and plasma plasma diagnostics and have been proposed for the fabrication of integrated circuits. These applications are discussed, and examples of first results are presented.

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