Electrostatic self-assembly processing of materials and devices

Details Electrostatic self-assembly processing of materials and devices Electrostatic self-assembly processing of materials and devices

Oct 2000

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2000spie.4134....1c&link_type=abstract

Proc. SPIE Vol. 4134, p. 1-5, Photonics for Space Environments VII, Edward W. Taylor; Ed.

Statistics

Applications

Scientific paper

Electrostatic self-assembly (ESA) methods have been used to synthesize multilayered thin film organic/inorganic materials and devices. The ESA method involves the dip coating of charged substrates with alternating layers of anionic and cationic molecules, and the properties of the resulting multilayered structures depend on both the characteristics of the individual molecules and the spatial order of the layers. Since the process is performed at room temperature and pressure by dipping substrates into separate solutions containing the charged molecules, coatings may be formed on substrates of virtually any composition, shape and size. Materials that have been investigated for incorporation into such coatings include noble metal nanoclusters, metal oxide nanoclusters, polymers, cage- structured molecules such as fullerenes, proteins, and dipolar chromophore molecules. Such materials have potential applications in photonic and electronic devices.

Affiliated with

Also associated with

No associations

Rating

Electrostatic self-assembly processing of materials and devices does not yet have a rating. At this time, there are no reviews or comments for this scientific paper.

If you have personal experience with Electrostatic self-assembly processing of materials and devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electrostatic self-assembly processing of materials and devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFWR-SCP-O-1107638