Investigations of bonded and curved microchannel plate stacks

Details Investigations of bonded and curved microchannel plate stacks Investigations of bonded and curved microchannel plate stacks

Jan 1988

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=1988spie..982..108s&link_type=abstract

IN: X-ray instrumentation in astronomy II; Proceedings of the Meeting, San Diego, CA, Aug. 15-17, 1988 (A89-40276 17-35). Bellin

Astronomy and Astrophysics

Astronomy

2

Electronic Packaging, Microchannel Plates, Power Gain, Pulse Amplitude, Surface Geometry

Scientific paper

The technique of fusing, or bonding, individual microchannel plate (MCP) stacks together offers the possibility of improving the uniformity of MCP stack operating characteristics and provides a convenient monolithic format. Here, the effectiveness of bonded MCP stacks and stacks of MCPs with curved surfaces is investigated to determine if MCP requirements for future astrophysical detectors can be achieved. The results show that both configurations give superior MCP performance characteristics. However, some problems remain with regard to the fabrication of bonded MCP stacks resulting in poor flat field characteristics and increased background.

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