Unique 3D architecture for high-resolution imaging

Details Unique 3D architecture for high-resolution imaging Unique 3D architecture for high-resolution imaging

Jun 1994

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=1994spie.2226..219l&link_type=abstract

Proc. SPIE Vol. 2226, p. 219-226, Infrared Readout Electronics II, Eric R. Fossum; Ed.

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Visible and infrared focal planes are becoming ever larger and more complicated, but the real estate for unit cell electronics is diminishing. Applications such as High Definition Television require very large format focal plane arrays and complex post image processing prior to data transmission. The authors describe in this paper a technique of combining an active pixel CMOS sensor, or a CCD image capture device with analog to digital conversion and data compression circuitry on the focal plane in a unique Z-technology architecture. This architecture incorporates a stack of signal processing integrated circuits physically connected below the image capture device which provides up to 10 times the unit cell electronics real estate for the data conditioning. This paper focuses on the interconnect techniques between the image capture device and the post processing electronics.

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