Through Silicon Vias as Enablers for 3D Systems

Details Through Silicon Vias as Enablers for 3D Systems Through Silicon Vias as Enablers for 3D Systems

2008-05-07

arxiv.org/abs/0805.0918v1

Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2008, Nice : France (2008)

Computer Science

Other Computer Science

Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838)

Scientific paper

This special session on 3D TSV's will highlight some of the fabrication processes and used technologies to create vias from the frontside of an active circuit to its backside and potential implementation solutions to form complex systems leveraging these novel possibilities. General techniques for via formation are discussed as well as advanced integration solutions leveraging the power of 3D TSV's.

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