Three-dimensional memory module for space application

Details Three-dimensional memory module for space application Three-dimensional memory module for space application

Dec 2002

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2002esasp.507..227y&link_type=abstract

Proceedings of the European Space Components Conference, ESCCON 2002, 24-27 September 2002, Toulouse, France. Compiled by R.A. H

Computer Science

Performance

Scientific paper

NASDA is developing a new high-speed, onboard microcomputer for space applications, such as micro satellites and space robots, which require high-performance MPUs and high-speed, high-volume memory systems. We selected the TZ-CSP (Fig. 1 Tape z-Axis chip-scale package) technology, a three-dimensional (3-D) assembly technology, to build a high-speed, high-performance memory system. This study investigated the long-term reliability and temperature characteristics of TZ-CSP diodes and resistors to examine their applicability to space systems. We conducted basic thermal cycle tests and moisture resistance tests and shock, vibration, and thermal shock tests on TZ-CSP samples in conformity with MIL-STD-202.

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