Thermoelectric Outer Planets Spacecraft (TOPS) electronic packaging and cabling development summary report

Details Thermoelectric Outer Planets Spacecraft (TOPS) electronic packaging and cabling development summary report Thermoelectric Outer Planets Spacecraft (TOPS) electronic packaging and cabling development summary report

Dec 1974

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=1974stin...7516736d&link_type=abstract

Unknown

Computer Science

Electric Connectors, Electric Wire, Electronic Packaging, Tops (Spacecraft), Laminates, Microminiaturized Electronic Devices, Spacecraft Components

Scientific paper

Electronic packaging and cabling activities performed in support of the Thermoelectric Outer Planets Spacecraft (TOPS) Advanced Systems Technology (AST) project are detailed. It describes new electronic compartment, electronic assembly, and module concepts, and a new high-density, planar interconnection technique called discrete multilayer (DML). Development and qualification of high density cabling techniques, using small gage wire and microminiature connectors, are also reported.

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