Thermal Analysis of FIMS TDC and LVPS Electronic Boards

Details Thermal Analysis of FIMS TDC and LVPS Electronic Boards Thermal Analysis of FIMS TDC and LVPS Electronic Boards

Dec 2002

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2002jass...19..283s&link_type=abstract

Journal of Astronomy and Space Science, vol. 19, no. 4, p. 283-292

Astronomy and Astrophysics

Astronomy

Finite-Elements Methods, Electronic Boards, Heat Transfer

Scientific paper

Electronic boards of Far-ultraviolet IMaging Spectrograph (FIMS) should be designed to maintain their performances, and their temperatures should be remained within the allowed temperatures in operational environments. Thermal analysis at the electronic board level has been performed, and it is confirmed the electronics parts could be kept within their allowed temperature ranges.

Affiliated with

Also associated with

No associations

Rating

Thermal Analysis of FIMS TDC and LVPS Electronic Boards does not yet have a rating. At this time, there are no reviews or comments for this scientific paper.

If you have personal experience with Thermal Analysis of FIMS TDC and LVPS Electronic Boards, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Thermal Analysis of FIMS TDC and LVPS Electronic Boards will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFWR-SCP-O-966259