Technology developments toward large format long wavelength bolometer arrays

Details Technology developments toward large format long wavelength bolometer arrays Technology developments toward large format long wavelength bolometer arrays

Oct 2007

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2007spie.6678e...4a&link_type=abstract

Infrared Spaceborne Remote Sensing and Instrumentation XV. Edited by Strojnik-Scholl, Marija. Proceedings of the SPIE, Volume

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We are developing a kilopixel, filled bolometer array for infrared astronomy. The array consists of three individual components, to be merged into a single, working unit; 1) a transition edge sensor (TES) bolometer array, operating in the milliKelvin regime, 2) quarter-wave resonance backshorts, and 3) superconducting quantum interference device (SQUID) multiplexer readout. The detector array is a filled, square-grid of suspended, silicon membrane bolometers with superconducting thermistors. The spacing of the backshort beneath the detector grid can be set from ~30-300 microns by adjusting two process parameters during fabrication. We have produced prototype, monolithic arrays having 1 mm and 2 mm pitch detectors. The key technologies required for kilopixel arrays of detectors to be hybridized to SQUID multiplexer readout circuits have been demonstrated. Mechanical models of large-format detector grids have been indium bump-bonded to dummy multiplexer readouts to study electrical continuity. A monolithic array of 1 mm pitch detectors has been mated to a backshort grid optimized for a 350 micron resonant wavelength. Through-wafer microvias, for electroplated, low-resistance electrical connection of detector elements, have been prototyped using deep reactive ion etching. The ultimate goal of this work is to develop large-format (thousands of pixels) bolometer array architecture with background-limited sensitivity, suitable for a wide range of long wavelengths and a wide range of astronomical applications such as imaging, spectroscopy, and polarimetry and applicable for ground-based, suborbital, and space-based instruments.

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