Surface Conditioning Effect on Vacuum Microelectronics Components Fabricated by Deep Reactive Ion Etching

Details Surface Conditioning Effect on Vacuum Microelectronics Components Fabricated by Deep Reactive Ion Etching Surface Conditioning Effect on Vacuum Microelectronics Components Fabricated by Deep Reactive Ion Etching

2007-11-21

arxiv.org/abs/0711.3276v1

Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2006, Stresa, Lago Maggiore : Italie (2006)

Computer Science

Other Computer Science

Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)

Scientific paper

Advances in material processing such as silicon micromachining are opening the way to vacuum microelectronics. Two-dimensional vacuum components can be fabricated using the microsystems processes. We developed such devices using a single metal layer and silicon micromachining by DRIE. The latter technological step has significant impact on the characteristics of the vacuum components. This paper presents a brief summary of electron emission possibilities and the design leading to the fabrication of a lateral field emission diode. First measurement results and the aging of the devices are also discussed.

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