State of the art test chip for the qualification of non-hermetic MCM encapsulation

Details State of the art test chip for the qualification of non-hermetic MCM encapsulation State of the art test chip for the qualification of non-hermetic MCM encapsulation

Dec 2002

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2002esasp.507..205p&link_type=abstract

Proceedings of the European Space Components Conference, ESCCON 2002, 24-27 September 2002, Toulouse, France. Compiled by R.A. H

Computer Science

Scientific paper

This paper describes first the conception of a chip dedicated to the
test of electronic packaging. Then first results obtained after sensor
calibrations are discussed. Finally, a new design of test chip, taking
into account previous experience is presented.

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