RF packaging for space applications

Details RF packaging for space applications RF packaging for space applications

Dec 2002

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2002esasp.507..199d&link_type=abstract

Proceedings of the European Space Components Conference, ESCCON 2002, 24-27 September 2002, Toulouse, France. Compiled by R.A. H

Computer Science

Performance

Scientific paper

Alcatel Space has been working in the field of RF hybrids for a long time. This paper presents the evolution of microwave packaging, up to 40 GHz, towards more and more miniaturisation. RF packaging presents challenging trade-offs between electrical performances and manufacturability, the higher the frequency; the more these two parameters are intertwined. An important step in the field of miniaturisation was the use, beginning of 90's, of MMICs based on GaAs - Gallium Arsenide - and micropackages, following by the introduction of mixed LF/MMwave MCM. Now a good choice could be made between those MCMs and advanced micropackages. The next evolution is the use of flip-chip interconnection to minimise the length of RF connections. In term of bonding reliability, the results give values over more than five times the limits from the standards, even after 500 thermal cycles. The association of power flip-chip which high thermal conductive substrates like Aluminum Nitride - could give at least 40% reduction in the Rth for an amplifier with MMIC mounted flip-chip with emitter bumps. The glob-top technology is not yet used for higher frequencies (i.e. some or some tens of GHz). However, the results presented in this paper show that glob-top are compatible with GaAs MMICs working up to 12 GHz. With some specific design rules, the right encapsulant and the associated processes, there are little degradations of the electrical performances of a Low Level Amplifier working at 10.7 - 12.7 GHz. This has been also checked after thermal cycles.Another emergent technology with MEMS - MicroElectroMechanical Systems - could be used soon for space application, especially for very small switches with low losses. This will be made only if they could be encapsulated with an adapted packaging and if the reliability is full demonstrated following space criteria. Now, those different technologies could be associated with other miniaturization new concepts adapted to the microwave needs, such as 3D technology, UTCS (Ultra Thin Chip Stacking) or SIP (System-In-Package).

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