Computer Science – Other Computer Science
Scientific paper
2008-05-07
Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2008, Nice : France (2008)
Computer Science
Other Computer Science
Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838)
Scientific paper
In this paper an experimental validation of numerical approaches aimed to predict the coupled behaviour of microbeams for out-of-plane bending tests is performed. This work completes a previous investigation concerning in plane microbeams bending. Often out-of-plane microcantilevers and clamped-clamped microbeams suffer the presence of residual strain and stress, which affect the value of pull-in voltage. In case of microcantilever an accurate modelling includes the effect of the initial curvature due to microfabrication. In double clamped microbeams a preloading applied by tensile stress is considered. Geometrical onlinearity caused by mechanical coupling between axial and flexural behaviour is detected and modelled. Experimental results demonstrate a good agreement between FEM approaches proposed and tests. A fairly fast and accurate prediction of pull-in condition is performed, thus numerical models can be used to identify residual stress in microbridges by reverse analysis from the measured value of pull-in voltage.
Ballestra Alberto
Brusa Eugenio
Munteanu Mircea Gh.
Pasquale Giorgio de
Somà Aurelio
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