Reliability Study of Surface Mounted 3D Molded Stacks Using BGA and Leadframe Attachment

Details Reliability Study of Surface Mounted 3D Molded Stacks Using BGA and Leadframe Attachment Reliability Study of Surface Mounted 3D Molded Stacks Using BGA and Leadframe Attachment

Jun 2000

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2000esasp.439...53v&link_type=gif

European Space Components Conference (ESCCON) (2000 : Noordwijk, The Netherlands). Proceedings of the European Space Components

Computer Science

Scientific paper

Not Available

Affiliated with

Also associated with

No associations

Rating

Reliability Study of Surface Mounted 3D Molded Stacks Using BGA and Leadframe Attachment does not yet have a rating. At this time, there are no reviews or comments for this scientific paper.

If you have personal experience with Reliability Study of Surface Mounted 3D Molded Stacks Using BGA and Leadframe Attachment, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Reliability Study of Surface Mounted 3D Molded Stacks Using BGA and Leadframe Attachment will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFWR-SCP-O-1348241