Reliability evaluation of components for the Chip on Board (CoB) technology in space application

Details Reliability evaluation of components for the Chip on Board (CoB) technology in space application Reliability evaluation of components for the Chip on Board (CoB) technology in space application

Dec 2002

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2002esasp.507...11l&link_type=abstract

Proceedings of the European Space Components Conference, ESCCON 2002, 24-27 September 2002, Toulouse, France. Compiled by R.A. H

Computer Science

Scientific paper

The paper gives an overview of the reliability evaluation of dice used
in Chip on Board Technology (CoB) and gives an assessment regarding the
experience gained for application of CoB in space designs.

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