Recent charge-coupled device optimization results at Steward Observatory

Astronomy and Astrophysics – Astronomy

Scientific paper

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Antireflection Coatings, Charge Coupled Devices, Electronic Packaging, Optimization, Quantum Efficiency, Energy Gaps (Solid State), Silicon, Wafers

Scientific paper

Recent research efforts aimed at optimizing charge-coupled devices (CCDs) after their manufacture to achieve maximum quantum efficiency, wide spectral bandpass, and excellent cosmetics and surface flatness are discussed. Results are presented of a new acid thinning agitation technique which produces very uniform, high-quality surfaces on large area square and rectangular CCDs and 4-in silicon wafers for back illuminated operation. A method of cleaning thinned CCDs before antireflection coating for increased quantum efficiency is also discussed. The results of initial experiments with a new packaging method to mount thinned CCDs while maintaining a very flat imaging surface are presented. This bump bonding mounting technique increases yield due to reduced handling and robust packaging and is expandable to tightly packed large area focal plane mosaics.

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