Process to fabricate thick coplanar microwave electrode structures

Details Process to fabricate thick coplanar microwave electrode structures Process to fabricate thick coplanar microwave electrode structures

Jun 1993

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=1993padn.reptt....m&link_type=abstract

Patent Application Department of the Navy, Washington, DC.

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Applications

Electrodes, Fabrication, Mercury Lamps, Photoconductivity, Plating, Waveguides, Current Density, Microwaves, Patent Applications, Planar Structures, Plasmas (Physics), Ultraviolet Radiation

Scientific paper

A process for making thick metal structures on a substrate has the steps of: selectively exposing a thick layer of photoresist disposed on a substrate to ultraviolet radiation including the 350 nm to 450 nm portion of the spectrum of a mercury vapor lamp, where the photoresist layer is a heat-treated and hydrated photoresist layer, to fully pattern the substrate; developing the patterned substrate by contacting the photoresist layer with a photoresist developing solution; exposing the photoresist layer to a plasma for hardening the pattern against thermal flow; hardbaking the photoresist pattern on the substrate; and plating the metal onto the patterned substrate using a low current density (J) during at least part of the plating process, making a thick metal structure on the substrate.

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