Other
Scientific paper
Oct 1997
adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=1997spie.3134..252b&link_type=abstract
Proc. SPIE Vol. 3134, p. 252-257, Optical Manufacturing and Testing II, H. Philip Stahl; Ed.
Other
1
Scientific paper
Pad polishing is an efficient technique for polishing-out a ground surface and reaching a figure better than one wave, ready for completion with less than an hour on a planetary polisher. Recent work has shown success on 350 mm square parts; current work involves scaling the process to 1.4 meter diameter. For the 350 mm square piece of BK7, removal was one micrometer every 10 minutes. Polishing-out from a 5 micrometer grind took less than 3 hours, to a surface smoothness of one nm rms. Other tests verified that the pad leaves no unusual subsurface damage. Following completion on a pitch planetary polisher, surface finish is the same as obtained for conventional processing.
Berggren Ralph R.
Schmell Rodney A.
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