Packaging roadmap

Details Packaging roadmap Packaging roadmap

Dec 2002

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2002esasp.507..371d&link_type=abstract

Proceedings of the European Space Components Conference, ESCCON 2002, 24-27 September 2002, Toulouse, France. Compiled by R.A. H

Statistics

Applications

Scientific paper

Atmel is investigating in new assembly technologies so as to better answer to the challenges raised by advanced space applications such as improved powerdissipation capability, better bias conductivity, higher pin count, smaller packages, cheaper assembly technologies, reusability, while improving their reliability. This paper reports current development activities and the road map they are aimed at. The European Space Industry and the Centre National d'Études Spatiales are supporting most of those activities.

Affiliated with

Also associated with

No associations

Rating

Packaging roadmap does not yet have a rating. At this time, there are no reviews or comments for this scientific paper.

If you have personal experience with Packaging roadmap, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaging roadmap will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFWR-SCP-O-964386