Near-room-temperature performance of an SWIR InGaAs/Si hybrid 96 elementx25 TDI high-performance FPA

Computer Science – Performance

Scientific paper

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Scientific paper

Performance of a SWIR FPA targeting LANDSAT S/N levels in the near room temperature (> 220 K) is presented. The FPA consists of a 96 X 25 element InGaAs array with 48 (mu) X 48 (mu) photo-voltaic pixels bump-bonded to a Si multiplexer. Cutoff wavelength of an array is tailored from 1.68 (mu) to 2.4 (mu) . The longer cutoff is required for Band 7. The multiplexer design incorporates a CMOS CCD process and is a 96 channel X 25 TDI scanning array with pixel pitch of 48 (mu) cross track by 96 (mu) intrack. Each unit cell uses a Capacitive Trans-Impedance Amplifier) with Correlated Double Sampling. Other notable chip features include electrically selectable TDI modes (0, 1, 8, 16, and 25), forward and reverse scan, and 1 X 1 and 2 X 2 aggregation modes. Timing and biases are self generated by the multiplexer.

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