Modeling of Magnetic-Field-Assisted Assembly of Semiconductor Devices

Details Modeling of Magnetic-Field-Assisted Assembly of Semiconductor Devices Modeling of Magnetic-Field-Assisted Assembly of Semiconductor Devices

Apr 2008

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2008jemat..37..374r&link_type=abstract

Journal of Electronic Materials, Volume 37, Issue 4, pp.374-378

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1

Mems, Microassembly, Self-Assembly, Magnetic Field, Heterogeneous Integration

Scientific paper

The process of magnetic-field-assisted assembly for the integration of semiconductor devices is described. A simplified model that is relevant to both magnetically assisted statistical assembly and magnetic-field-assisted assembly is presented. This two-dimensional, periodic model, which is a development of earlier work by Fonstad and coworkers, is solved using Fourier series, and an expression is found for the magnetic force of attraction between a soft magnetic layer and an array of permanently magnetized strips. The results show an exponential decrease of force with distance and the dependence of the force on other parameters such as layer thickness and spacing.

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