Computer Science – Other Computer Science
Scientific paper
2008-02-21
Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2007, Stresa, lago Maggiore : Italie (2007)
Computer Science
Other Computer Science
Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/EDA-Publishing)
Scientific paper
Today, hot embossing and injection molding belong to the established plastic molding processes in microengineering. Based on experimental findings, a variety of microstructures have been replicated so far using the processes. However, with increasing requirements regarding the embossing surface and the simultaneous decrease of the structure size down into the nanorange, increasing know-how is needed to adapt hot embossing to industrial standards. To reach this objective, a German-Canadian cooperation project has been launched to study hot embossing theoretically by a process simulation and experimentally. The present publication shall report about the first results of the simulation - the modeling and simulation of large area replication based on an eight inch microstructured mold.
Heckele M.
Hétu J.-F.
Kabanemi K. K.
Marcotte J.-P.
Worgull M.
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