Microwave 3D concept for beam forming networks

Details Microwave 3D concept for beam forming networks Microwave 3D concept for beam forming networks

Dec 2002

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2002esasp.507..221v&link_type=abstract

Proceedings of the European Space Components Conference, ESCCON 2002, 24-27 September 2002, Toulouse, France. Compiled by R.A. H

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The development of active antennas for space applications has reinforced the need for RF BFNs - Beam Forming Networks. A BFN connects m RF inputs to m RF Outputs to form N independent and simultaneous beams. The resulting matrix has m x n internal connections. Typically, this number runs into the hundreds, which make it impossible to be implemented with a classical concept. Even the technology based on multilayer printed circuit boards is limited in : frequency mainly due to the mechanical accuracy on materials and processes, integration because all the components could be bonded only on the surface of the boards. The new concept presented in this paper is compatible with BFN in the Ka band and upper frequencies. This "vertical" BFN is using the RF 3D technology; in that way the capacity of interconnection is drastically improved because all the routing moved to the surface of the module with all the components encapsulated inside the module. Main of the fundamental technology points are addressed : availability for molding very large modules up to 110 x 110 mm with the capability to keep all the advantages of the 3D technology, a 3D CPW (CoPlanar Waveguide) intercon- nection on a low dielectric constant resin, micro-connectors implemented with surface mount technology and working up to 30 GHz. A test vehicle including all those points is also presented with the first results on the reliability tests mainly based on thermal cycles in the range -55/+125°C.

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