Microfabrication and Device Parameter Testing of the Focal Plane Arrays for the Spider and BICEP2/Keck CMB Polarimeters

Details Microfabrication and Device Parameter Testing of the Focal Plane Arrays for the Spider and BICEP2/Keck CMB Polarimeters Microfabrication and Device Parameter Testing of the Focal Plane Arrays for the Spider and BICEP2/Keck CMB Polarimeters

Dec 2009

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2009aipc.1185..367b&link_type=abstract

THE THIRTEENTH INTERNATIONAL WORKSHOP ON LOW TEMPERATURE DETECTORS-LTD13. AIP Conference Proceedings, Volume 1185, pp. 367-370

Other

Bolometers, Solar System, Cryogenics, Photoconductors And Bolometers, Cosmology, Cryogenics, Refrigerators, Low-Temperature Detectors, And Other Low-Temperature Equipment

Scientific paper

Spider and BICEP2/Keck are projects to study the polarization of the cosmic microwave background (CMB). The focal planes for both require large format arrays of superconducting transition edge sensors (TES's). A major challenge for these projects is fabricating arrays with high uniformity in device parameters. A microfabrication process is described that meets this challenge. The results from device testing are discussed. Each focal plane is composed of 4 square wafers (tiles), and each wafer contains 128 membrane-isolated, polarization-sensitive, antenna-coupled TES's. After processing, selected wafers are pre-screened in a quick-turn-around, cryogen-free, 3He fridge. The pre-screening is performed with a commercial resistance bridge and measures transition temperatures (Tc) and normal state resistances (Rn). After pre-screening, 4 tiles at a time are fully characterized in a testbed employing a SQUID readout and SQUID mulitplexing. The tests demonstrate the values of Tc, Rn, thermal conductance, g, and the standard deviations of each, across a wafer and from wafer to wafer, are within design specifications.

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