Statistics – Applications
Scientific paper
Jan 1997
adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=1997aipc..387..819s&link_type=abstract
Space technology and applications international forum (STAIF - 97). AIP Conference Proceedings, Volume 387, pp. 819-824 (1997).
Statistics
Applications
Micromechanical Devices And Systems, Instruments For Strain, Force, And Torque
Scientific paper
Mechanical stresses in advanced electronic packages for space and terrestrial applications can cause premature failures due to such causes as fracture of the die, severing of connections, die bond failure, solder fatigue, and encapsulant cracking. These stresses are often thermally-induced, and result from uneven expansions and contractions of the various assembly materials due to mismatches in the coefficients of thermal expansion (CTE's). In this work, special (111) silicon test chips containing an array of piezoresistive stress sensor rosettes have been applied within several plastic encapsulated electronic packaging configurations. The test chips contain optimized eight element dual polarity rosettes which are capable of evaluating the complete stress state (6 stress components) at points on the surface of the die. Calibrated and characterized test chips were packaged in chip-on-board configurations using ``glob-top'' liquid encapsulants. The post packaging room temperature resistances of the sensors were then recorded. Using the measured resistance changes and appropriate theoretical equations, the stresses in the die have been calculated. Also, three-dimensional nonlinear finite element simulations of the chip-on-board packages were performed. The experimental results were in good agreement with the finite element predictions.
Jaeger R. C.
Johnson William R.
Lin T.-S.
Moral R. J.
Suhling J. C.
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