High Thermal Conductivity Graphite Electronic Components

Details High Thermal Conductivity Graphite Electronic Components High Thermal Conductivity Graphite Electronic Components

Aug 1996

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=1996stin...9725095p&link_type=abstract

Technical Report, Space Systems/Loral Palo Alto, CA United States

Computer Science

Performance

Graphite, Thermal Conductivity, Spacecraft Components, Heat Transfer, Fabrication, Chips (Electronics), Printed Circuits, Thermal Analysis, Aerospace Environments, Heat Sources, Tensile Strength, Thermal Stability, Thermal Expansion, Electrical Resistance, Compressive Strength

Scientific paper

This project will apply high thermal conductivity graphite to three major spacecraft electronic components: (1) the thermal plane of a printed wiring board, (2) the subassembly or tray that holds the board, and (3) the equipment panel that the tray mounts on. The complete heat transfer path from chip level heat source to radiative rejection on the exterior surface of the equipment panel will therefore be addressed. Thermal and structural requirements representative of current spacecraft will drive an optimized solution strategy. The project will be completed by fabricating the three prototypical test articles and measuring their performance in a representative space environment.

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