Statistics – Applications
Scientific paper
Mar 1991
adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=1991esasp.313..175l&link_type=abstract
In ESA, ESA Electronic Components Conference p 175-178 (SEE N91-32291 24-33)
Statistics
Applications
Assembling, Electronic Packaging, Semiconductor Lasers, Thermal Resistance, Chips (Electronics), Heat Sinks, Laser Materials, Reliability Analysis, Space Environment Simulation
Scientific paper
Laser diode mounting and packaging techniques are discussed and the space compatibility of the materials and designs reviewed. Materials and designs are examined against the drive current, output power, temperature, and environmental and mechanical conditions specific to space applications. Low power laser diodes for optical databases and laser diodes operating at more than 20mW CW optical output power, suitable for free space links are considered. Particular areas of study are thermal effects at the chip/heat sink interface, package rigidity and hermiticity, chip bonding and coupling of the lasers optical output to either a telescope or a fiber.
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