High Density Through Silicon Via (TSV)

Details High Density Through Silicon Via (TSV) High Density Through Silicon Via (TSV)

2008-05-07

arxiv.org/abs/0805.0922v1

Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2008, Nice : France (2008)

Computer Science

Other Computer Science

Submitted on behalf of EDA Publishing Association (http://irevues.inist.fr/handle/2042/16838)

Scientific paper

The Through Silicon Via (TSV) process developed by Silex provides down to 30 micrometers pitch for through wafer connections in up to 600 micrometers thick substrates. Integrated with MEMS designs it enables significantly reduced die size and true "Wafer Level Packaging" - features that are particularly important in consumer market applications. The TSV technology also enables integration of advanced interconnect functions in optical MEMS, sensors and microfluidic devices. In addition the Via technology opens for very interesting possibilities considering integration with CMOS processing. With several companies using the process already today, qualified volume manufacturing in place and a line-up of potential users, the process is becoming a standard in the MEMS industry. We provide a introduction to the via formation process and also present some on the novel solutions made available by the technology.

Affiliated with

Also associated with

No associations

Rating

High Density Through Silicon Via (TSV) does not yet have a rating. At this time, there are no reviews or comments for this scientific paper.

If you have personal experience with High Density Through Silicon Via (TSV), we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and High Density Through Silicon Via (TSV) will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFWR-SCP-O-491163