Hermetically Sealed On-Chip Packaging of MEMS Devices

Details Hermetically Sealed On-Chip Packaging of MEMS Devices Hermetically Sealed On-Chip Packaging of MEMS Devices

Jun 2000

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2000esasp.439...67d&link_type=gif

European Space Components Conference (ESCCON) (2000 : Noordwijk, The Netherlands). Proceedings of the European Space Components

Computer Science

Scientific paper

Not Available

Affiliated with

Also associated with

No associations

Rating

Hermetically Sealed On-Chip Packaging of MEMS Devices does not yet have a rating. At this time, there are no reviews or comments for this scientific paper.

If you have personal experience with Hermetically Sealed On-Chip Packaging of MEMS Devices, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Hermetically Sealed On-Chip Packaging of MEMS Devices will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFWR-SCP-O-1348245