General analysis of infrared focal plane array performance versus focal plane array operating temperature, number of TDI elements, diode area and cut-off wavelength

Details General analysis of infrared focal plane array performance versus focal plane array operating temperature, number of TDI elements, diode area and cut-off wavelength General analysis of infrared focal plane array performance versus focal plane array operating temperature, number of TDI elements, diode area and cut-off wavelength

Jul 1994

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=1994spie.2225..404c&link_type=abstract

Proc. SPIE Vol. 2225, p. 404-417, Infrared Detectors and Focal Plane Arrays III, Eustace L. Dereniak; Robert E. Sampson; Eds.

Computer Science

Performance

Scientific paper

IR systems require more and more performance (high sensitivity, resolution,...) to be adapted to specific system applications (such as surveillance and tracking systems...). To achieve such requirements, IRFPA manufacturers have to perform tradeoffs involving many parameters such as FPA operating temperature, number of TDI elements, cutoff wavelength, and diode area. IRFPA technologies and system limitations must be taken into account for these analyses. Thus, the authors present the general analysis of effects of these parameters on Sofradir IRFPA performance mainly utilizing 8 to 12 micron spectral band mercury cadmium telluride detector arrays. Impacts on electro-optical performance parameters and on thermal characteristics are presented. For example TDI linear scanning arrays are analyzed with emphasis on high IRFPA performance based on existing IRFPA technologies. Advantages of choices of different IRFPA configurations are presented.

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