Fabrication and integration of micro/nano-scale optical wire circuit arrays and devices for high-speed and compact optical printed circuit board (O-PCB) and VLSI photonic applications

Details Fabrication and integration of micro/nano-scale optical wire circuit arrays and devices for high-speed and compact optical printed circuit board (O-PCB) and VLSI photonic applications Fabrication and integration of micro/nano-scale optical wire circuit arrays and devices for high-speed and compact optical printed circuit board (O-PCB) and VLSI photonic applications

Sep 2005

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2005spie.5897...84l&link_type=abstract

Photonics for Space Environments X. Edited by Taylor, Edward W. Proceedings of the SPIE, Volume 5897, pp. 84-96 (2005).

Computer Science

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Scientific paper

We report on the design, fabrication and integration of micro/nano-scale optical wire circuit arrays and devices for high-speed, compact, light-weight, low power optical printed circuit boards (O-PCBs) and VLSI photonic applications. The optical wires are formed in the form of waveguides by thermal embossing and ultraviolet (UV) radiated embossing of polymer materials. The photonic devices include vertically coupled surface emitting laser (VCSEL) microlasers, microlenses, 45-degree reflection couplers, directional couplers, arrayed waveguide grating structures, multimode interference (MMI) devices and photodetectors. These devices are optically interconnected and integrated for O-PCB assembly and VLSI micro/nano-photonics. The O-PCBs are to perform the functions of transporting, switching, routing and distributing optical signals on flat modular boards or substrates. We report on the result of the optical transmission performances of these assembled O-PCBs. For the design, fabrication, and VLSI integration of nano-scale photonic devices, we used photonic crystal structures and plasmonic metallic waveguide structures. We examined the bandwidth, power dissipation, thermal stability, weight, and the miniaturization and density of optical wires and the O-PCB module. Characteristics of these devices are also described.

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