Evaporative modeling for idealized lithographic pores

Computer Science – Performance

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Heat Flow In Porous Media, Lithography, Masks And Pattern Transfer, Microcircuit Quality, Noise, Performance, And Failure Analysis, Spaceborne And Space Research Instruments, Apparatus, And Components

Scientific paper

As a demand for the high performance and small size electronics devices increased, the heat removal from those electronic devices for space use is getting critical factor more than devices on the earth due to the limitation of the size. The purpose of this paper is to show a study of optimized size of coherent pores or slits in the evaporative wick of a heat pipe to cool down the high heat flux density heat source. Our system considered in this paper consists of a plate heat source, the evaporative wick with coherent pores and conducting walls connecting between the heat source and the evaporator. The evaporation rate of working fluid along the meniscus interface in a micro-order pore or slit was calculated based on the kinetic theory and the statistical rate theory to find a proper diameter of pores to cool down the heat source effectively. The results show the smaller diameter of pores is preferred to achieve the smallest total size of the evaporator although it will involve the cost issue. As a demand for the high performance and small size electronics devices increased, the heat removal from those electronic devices for space use is getting critical factor more than devices on the earth due to the limitation of the size. The purpose of this paper is to show a study of optimized size of coherent pores or slits in the evaporative wick of a heat pipe to cool down the high heat flux density heat source. Our system considered in this paper consists of a plate heat source, the evaporative wick with coherent pores and conducting walls connecting between the heat source and the evaporator. The evaporation rate of working fluid along the meniscus interface in a micro-order pore or slit was calculated based on the kinetic theory and the statistical rate theory to find a proper diameter of pores to cool down the heat source effectively. The results show that the smaller diameter of pores uses the pore for evaporation effectively and is preferred to achieve the smallest total size of the evaporator for the same heat removal performance. As the demand for high performance and small size in electronics devices has increased, heat removal from these electronic devices is a critical factor. Lithographic techniques have been used to produce micron scale pore and surface structures in silicon. These are referred to as coherent wick structures. The purpose of this paper is to describe a study of optimized coherent pores or slits in the evaporative wick of a heat pipe with the high heat flux density heat source. The system considered in this paper consists of a plate heat source, the evaporative wick with coherent pores and conducting walls connecting the heat source and the evaporator. The evaporation along the meniscus interface in a micron scale pore or slit is calculated based on kinetic theory and statistical rate theory to optimize the diameter of pores. Calculations show that 80% of the evaporative energy is carried away in only less than 50% of the pore outer radius. Further, the results show that the smaller pore size has the higher evaporation rate per horizontal area and is preferred to achieve the smallest total size of the evaporator for the same heat removal performance. .

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