Evaluation of 3D plus packaging test structures for NASA Goddard Space Flight Center

Details Evaluation of 3D plus packaging test structures for NASA Goddard Space Flight Center Evaluation of 3D plus packaging test structures for NASA Goddard Space Flight Center

Dec 2002

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2002esasp.507..213p&link_type=abstract

Proceedings of the European Space Components Conference, ESCCON 2002, 24-27 September 2002, Toulouse, France. Compiled by R.A. H

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Environmental tests were performed on packaging test structures designed and manufactured for ESA and CNES by 3D Plus Electronics. The design provided circuit elements that acted as thermal, mechanical and moisture sensors. Other design features showed the compatibility of the packaging with chip passives, bare electronic dice and plastic encapsulated microcircuits packaged together in an innovative, stacked multichip module. The NASA GSFC testing augmented long duration testing on the same units carried out by ESA and CNES. The NASA portion demonstrated packaging stability over temperature, in moisture, with voltage stress, in shock and in vibration environments.

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