Electromechanical Reliability Testing of Three-Axial Silicon Force Sensors

Computer Science – Other Computer Science

Scientific paper

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)

Scientific paper

This paper reports on the systematic electromechanical characterization of a new three-axial force sensor used in dimensional metrology of micro components. The siliconbased sensor system consists of piezoresistive mechanicalstress transducers integrated in thin membrane hinges supporting a suspended flexible cross structure. The mechanical behavior of the fragile micromechanical structure isanalyzed for both static and dynamic load cases. This work demonstrates that the silicon microstructure withstands static forces of 1.16N applied orthogonally to the front-side of the structure. A statistical Weibull analysis of the measured data shows that these values are significantly reduced if the normal force is applied to the back of the sensor. Improvements of the sensor system design for future development cycles are derived from the measurement results.

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for scientists and scientific papers. Rate them and share your experience with other people.

Rating

Electromechanical Reliability Testing of Three-Axial Silicon Force Sensors does not yet have a rating. At this time, there are no reviews or comments for this scientific paper.

If you have personal experience with Electromechanical Reliability Testing of Three-Axial Silicon Force Sensors, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Electromechanical Reliability Testing of Three-Axial Silicon Force Sensors will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFWR-SCP-O-413969

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.