Electrically Isolating Subsystems in SOAC Technologies

Details Electrically Isolating Subsystems in SOAC Technologies Electrically Isolating Subsystems in SOAC Technologies

Jan 2001

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2001iaop.work...14b&link_type=abstract

Forum on Innovative Approaches to Outer Planetary Exploration 2001-2020, p. 14

Computer Science

Microelectronics, Integrated Circuits, Cmos, Soi (Semiconductors), Spacecraft Instruments

Scientific paper

Integrated circuit fabrication technology has evolved to the point that it is possible to construct complete systems, including power, data processing, and communications, on a single chip. Such System-on-a-chip (SOAC) technologies can enable drastic reductions in spacecraft size and weight, lowering the cost of missions and presenting new mission opportunities. This paper overviews some key enabling technologies unique to the needs of spacecraft for outer-planet exploration and missions requiring extreme resistance to radiation such as Europa orbiters and Europa Landers. The work is being carried out by Kansas State University (KSU) under direction of the Center for Integrated Space Microsystems (CISM) at NASA's Jet Propulsion Laboratory. Additional information is contained in the original extended abstract.

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