Development and testing of a planar, silicon mini-capillary pumped loop

Details Development and testing of a planar, silicon mini-capillary pumped loop Development and testing of a planar, silicon mini-capillary pumped loop

Jan 2002

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2002aipc..608...81y&link_type=abstract

SPACE TECHNOLOGY AND APPLICATIONS INTERNATIONAL FORUM- STAIF 2002. Conference on Thermophyiscs in Microgravity; Conference on In

Other

Cryogenics, Refrigerators, Low-Temperature Detectors, And Other Low-Temperature Equipment, Micro- And Nano-Electromechanical Systems And Devices, Spaceborne And Space Research Instruments, Apparatus, And Components

Scientific paper

A planar, silicon mini-capillary pumped loop (CPL) was designed, built, and tested using recent MEMS technology to provide integral cooling and temperature control for electronics. This design featured three silicon fusion bonded wafers incorporating an evaporator, condenser, liquid line and vapor line, all of which were dry plasma etched. Grooves were etched in the condenser and evaporator to provide passive capillary pumping. The finished device was bonded to an external reservoir via a through hole and was filled with a working fluid of water. The evaporator was bonded directly to an insulated gate bipolar transistor (IGBT) with a calorimeter epoxied above the condenser to control the temperature and monitor heat removal by the CPL. The mini-CPL was operated with an input heat load ranging from 3 to 10 W resulting in the junction temperature of the IGBT being reduced approximately 15 degrees Celsius from that of a solid Si substrate. The mini-CPL also performed as a thermal diode, turning on or off depending on the reservoir temperature. Work is in progress to understand the dynamics observed in the CPL as well as improve the CPL's performance. .

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