Current HYMOSS Z-technology overview

Details Current HYMOSS Z-technology overview Current HYMOSS Z-technology overview

Nov 1990

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=1990spie.1339..128l&link_type=abstract

IN: Materials, devices, techniques, and applications for Z-plane focal plane array technology II; Proceedings of the Meeting, Sa

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Applications

1

Focal Plane Devices, Integrated Circuits, Parallel Processing (Computers), Silicon Junctions, Superconductors, Electronic Packaging, Memory (Computers), Mercury Cadmium Tellurides, Mosaics

Scientific paper

This paper provides an overview of the current state-of-the-art HYMOSS (Hybrid Mosaic On Stacked Silicon) Z-technology. In the first part of this paper, an introduction to the HYMOSS physical characteristics is presented. This includes a description of the stacked substrates (cube) and mounting hardware (module). The basic steps in manufacturing HYMOSS are covered. The paper concludes with a description of the two newest endeavors for HYMOSS technology: stacking of superconducting ICs, digital memory, and processor ICs.

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