Contactless Thermal Characterization Method of PCB-s Using an IR Sensor Array

Details Contactless Thermal Characterization Method of PCB-s Using an IR Sensor Array Contactless Thermal Characterization Method of PCB-s Using an IR Sensor Array

2007-11-21

arxiv.org/abs/0711.3324v1

Dans Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS - DTIP 2006, Stresa, Lago Maggiore : Italie (2006)

Computer Science

Other Computer Science

Submitted on behalf of TIMA Editions (http://irevues.inist.fr/tima-editions)

Scientific paper

In this paper the feasibility study of an IR sensor card is presented. The methodology and the results of a quasi real-time thermal characterization tool and method for the temperature mapping of circuits and boards based on sensing the infrared radiation is introduced. With the proposed method the IR radiation-distribution of boards from the close proximity of the sensor card is monitored in quasi real-time. The proposed method is enabling in situ IR measurement among operating cards of a system e.g. in a rack.

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