Back-illuminated three-dimensionally integrated CMOS image sensors for scientific applications

Details Back-illuminated three-dimensionally integrated CMOS image sensors for scientific applications Back-illuminated three-dimensionally integrated CMOS image sensors for scientific applications

Sep 2007

adsabs.harvard.edu/cgi-bin/nph-data_query?bibcode=2007spie.6690e...7s&link_type=abstract

Focal Plane Arrays for Space Telescopes III. Edited by Grycewicz, Thomas J.; Marshall, Cheryl J.; Warren, Penny G.. Proceeding

Computer Science

Scientific paper

SOI-based active pixel image sensors have been built in both monolithic and vertically interconnected pixel technologies. The latter easily supports the inclusion of more complex pixel circuitry without compromising pixel fill factor. A wafer-scale back-illumination process is used to achieve 100% fill factor photodiodes. Results from 256 x 256 and 1024 x 1024 pixel arrays are presented, with discussion of dark current improvement in the differing technologies.

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